Sponsors

Hitachi Power Semiconductor Device, Ltd. Toyota

Applied Materials
Fuji Electric
DENSO
MITSUBISHI ELECTRIC ROHM

SUMITOMO ELECTRIC 株式会社コベルコ科研 東芝ナノアナリシス株式会社 株式会社東レリサーチセンター Canon FEI synopsys transphorm SHINDENGEN

Paper Submission:
Author Information

Important deadlines

Regular paper
- Abstract submission page close.
- Abstract submission deadline: November 15, 2016 23:59 (GMT -0700)
   NEW abstract submission deadline:
   November 24, 2016 23:59 (GMT -0700) (One time extension)
- Decision notification: January 25, 2017

- Final manuscripts submission deadline: March 31, 2017



Final manuscript submissions

- Final manuscript submission must be made on-line from this web site.
- Email submissions will NOT be accepted.



Categories and topic examples
for ISPSD 2017
1. High voltage devices (HV)

High voltage silicon based discrete device (> 200V), including
- IGBTs, thyristors, GTOs and PiN diodes
- Superjunction MOSFET and new unipolar device
- High voltage power device failure mechanism
- Wafer technology and lifetime control
- New gate drive method to enhance IGBT and Superjunction MOSFET performance
- Safe operating area and current filament effect in IGBT
- New edge termination
- Simulation or measurement technology related to this category


2. Low voltage devices and power IC device technology (LVT)

Low voltage silicon base discrete power device ( ≤ 200V) and power devices for power ICs for all voltage range, including
- High performance power MOSFET for DC-DC converters
- LIGBT, LDMOS for 600V power ICs
- SOI power devices for power ICs
- Power device design on BCD technology
- Device isolation technology
- MOSFET structure for level shifter
- Process integration for low voltage power devices
- SOA of LDMOSFET
- Simulation / measurement technology related to this category
(LVT category covers device design, device idea and device physics etc..)


3. Power IC design (ICD)

Circuit design and demonstration using power IC technology platform, including
- Gate driver IC design
- New circuit and layout design enhancing power IC performance
- Single chip inverters
- New signal isolation technology on power IC such as magnetic coupling
- Power SoC and passive component integration on a chip
- ESD protection circuit
- Compact circuit model for power IC design
- New type of hybrid power ICs
- Simulation / measurement technology related to this category
(ICD category covers power IC circuit design, system integration and IC architecture etc..)


4. GaN and nitride base compound materials (GaN)

GaN and nitride base power devices and ICs, including
- AlGaN/GaN hetero device
- Vertical GaN MISFET
- AlN power devices and ICs
- Special circuit and application for GaN and nitride base power devices
- GaN and nitride base power ICs
- Special application for GaN and nitridel devices
- New process integration for GaN power IC
- Simulation / measurement technology related to this category


5. SiC and other materials (SiC)

SiC and other material base power devices and ICs, including
- SiC power MOSFET, IGBT, SIT
- SiC power ICs
- Diamond power devices and ICs
- Gallium oxide power devices and ICs
- Special application for SiC and other material devices
- New process technology for SiC and other material devices
- Simulation / measurement technology related to this category


6. Module and Package Technologies (PK)

Module and Package technology for discrete power devices and power ICs, including
- Power module, Transfer molded package demonstration
- Power module design including wire frame
- Chip current and temperature measurement
- Pressure contact packages for high power system applications
- Thermal management and new cooling technology
- Stress and strain simulation for package structures and materials
- 3D-package and stray inductance management
- Package design against noise and switching losses
- Reliability physics and failure analysis related to package design and material
- Package insulation technology and material, high temperature endurance
- Power SiP hardware design
- Simulation / measurement technology related to this category